AI Overview
尼康正策略性地調整其半導體業務，轉向顛覆性創新，不再與ASML的極紫外線（EUV）技術直接競爭，而是專注於新興技術，特別是奈米壓印光刻和先進晶片封裝。這項策略充分利用了尼康在傳統微縮並非主要驅動力的領域的精密工程優勢，旨在重新定義晶片製造，尤其是在人工智慧和高效能運算領域。 YouTube +2
關鍵顛覆性技術與策略：奈米壓印光刻（NIL）：尼康正致力於將NIL作為傳統光刻技術的顛覆性替代方案，以更低的成本和更高的效率實現高解析度圖案化，尤其適用於非前沿節點。
先進晶片封裝：尼康正將業務拓展至先進封裝領域，這是整合異構晶片組件以在不依賴傳統微縮技術的情況下提升性能的關鍵領域。 新一代微光刻工具：Nikon持續創新ArF（氟化氬）浸沒式掃描儀，並對其進行改進以支援下一代高性能製造技術。
高精度計量與檢測：Nikon正利用其精密工程技術，開發先進的無損X射線和CT檢測技術，這對於發現先進半導體封裝中的微小缺陷至關重要。 數位光刻與製造：尼康正在探索數位光刻技術，與傳統的光罩技術相比，這項技術更加重視靈活性並減少浪費。 YouTube +6
聚焦成長領域 尼康並沒有爭奪最先進的5奈米以下光刻技術的壟斷地位，而是採取顛覆性策略，致力於滿足日益增長的專用感測器、功率裝置和封裝解決方案的需求。這包括： YouTube +1
汽車與互聯：為用於5G/6G和電動車技術的化合物半導體（氮化鎵/碳化矽）生產專用系統。 智慧感測器技術：應用先進的影像技術，為工業和消費性物聯網打造更高品質的感測器。 尼康 +2 透
過採用這些替代技術，尼康旨在未來晶片製造領域佔據主導地位。
Nikon is strategically pivoting its semiconductor sector toward disruptive innovation by moving away from direct competition with ASML’s extreme ultraviolet (EUV) technology and focusing on emerging technologies, specifically nanoimprint lithography and advanced chiplet packaging. This strategy leverages Nikon's precision engineering in areas where traditional scaling is not the primary driver, aiming to redefine chip manufacturing, particularly in the AI and high-performance computing sectors.
YouTube +2
Key Disruptive Technologies & StrategiesNanoimprint Lithography (NIL): Nikon is focusing on NIL as a disruptive alternative to conventional lithography, offering high-resolution patterning at lower costs and higher efficiency, especially for non-leading-edge nodes.
Advanced Chiplet Packaging: Nikon is expanding its focus into advanced packaging, a critical area for integrating heterogeneous chip components to boost performance without traditional scaling.
Next-Gen Micro-Lithography Tools: Nikon continues to innovate in ArF (Argon Fluoride) immersion scanners, enhancing them to support next-generation, high-performance manufacturing techniques.
High-Precision Metrology & Inspection: Nikon is leveraging its precision engineering for advanced, non-destructive X-ray and CT inspection, which are critical for finding tiny defects in advanced semiconductor packaging.
Digital Lithography and Manufacturing: Nikon is exploring digital lithography, a shift that focuses on flexibility and reduced waste compared to traditional masking techniques.
YouTube +6
Focus on Growth Areas
Rather than battling for the most advanced sub-5nm lithography monopoly, Nikon’s disruptive approach targets the growing need for specialized sensors, power devices, and packaging solutions. This includes:
YouTube +1Automotive & Connectivity: Producing specialized systems for compound semiconductors (gallium nitride/silicon carbide) used in 5G/6G and EV technologies.
Smart Sensor Technologies: Applying advanced imaging technologies to create better quality sensors for industrial and consumer IoT.
Nikon +2
By embracing these alternative technologies, Nikon aims to carve out a dominant niche in the future landscape of chip fabrication.
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Nikon is strategically pivoting its semiconductor sector toward disruptive innovation by moving away from direct competition with ASML’s extreme ultraviolet (EUV) technology and focusing on emerging technologies, specifically nanoimprint lithography and advanced chiplet packaging. This strategy leverages Nikon's precision engineering in areas where traditional scaling is not the primary driver, aiming to redefine chip manufacturing, particularly in the AI and high-performance computing sectors.
YouTube +2Key Disruptive Technologies & StrategiesNanoimprint Lithography (NIL): Nikon is focusing on NIL as a disruptive alternative to conventional lithography, offering high-resolution patterning at lower costs and higher efficiency, especially for non-leading-edge nodes.
Advanced Chiplet Packaging: Nikon is expanding its focus into advanced packaging, a critical area for integrating heterogeneous chip components to boost performance without traditional scaling.
Next-Gen Micro-Lithography Tools: Nikon continues to innovate in ArF (Argon Fluoride) immersion scanners, enhancing them to support next-generation, high-performance manufacturing techniques.
High-Precision Metrology & Inspection: Nikon is leveraging its precision engineering for advanced, non-destructive X-ray and CT inspection, which are critical for finding tiny defects in advanced semiconductor packaging.
Digital Lithography and Manufacturing: Nikon is exploring digital lithography, a shift that focuses on flexibility and reduced waste compared to traditional masking techniques.
YouTube +6Focus on Growth Areas
Rather than battling for the most advanced sub-5nm lithography monopoly, Nikon’s disruptive approach targets the growing need for specialized sensors, power devices, and packaging solutions. This includes:
YouTube +1Automotive & Connectivity: Producing specialized systems for compound semiconductors (gallium nitride/silicon carbide) used in 5G/6G and EV technologies.Smart Sensor Technologies: Applying advanced imaging technologies to create better quality sensors for industrial and consumer IoT.
Nikon +2By embracing these alternative technologies, Nikon aims to carve out a dominant niche in the future landscape of chip fabrication.
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半導體業務虧損
Nikon 預估 2025 財年將虧損高達 850 億日圓，創下這家百年光學巨頭自 1917 年創立以來的最慘紀錄。過去半年，Nikon 的半導體曝光機僅出貨 9 台，而競爭對手 ASML 同期賣出 327 台，其中高階 EUV 機型就佔 48 台。這場懸殊的對比，折射出一段長達二十餘年的戰略失誤史。
Nikon 的衰落，關鍵轉折點發生在 2002 年。台積電前高層林本堅提出「浸潤式曝光」技術構想，利用水的折射率縮短光源波長，是當時突破微影製程瓶頸的最可行路徑。然而 Nikon 高層因已在舊技術路線投入數億美元而選擇拒絕，甚至試圖以業界威望封殺這項提議。ASML 抓住機會，於 2004 年與台積電合作推出全球第一台浸潤式曝光機，從此一路逆轉，2010 年後市佔率突破 70%。此後 Nikon 雖投入逾千億日圓嘗試自行研發 EUV 技術，但閉門造車的垂直整合模式讓他們燒錢至 2018 年仍只有無法商用的原型機；加上過度依賴 Intel 單一客戶，Intel 削減資本支出後訂單隨即崩盤，又因配合美國出口管制放棄中國市場，2025 年 9 月不得不關閉營運 58 年的橫濱工廠。
Nikon 的故事，是一個曾經的標準制定者因無法擁抱開放協作而被時代淘汰的典型案例。相比之下，ASML 接受台積電、Intel 與三星的戰略投資，聯合全球頂尖供應商建立起無可替代的技術生態，如今更進一步跨足先進封裝市場。另一家日本廠商 Canon 則另闢蹊徑，專注成熟製程並投入成本僅 EUV 十分之一的奈米壓印技術，試圖在巨頭夾縫中求生。這場半導體設備的競賽已然說明，在顛覆性技術面前，過往的成功經驗有時反而是最沉重的包袱。
